microTEC develops and produces micro systems and components. Our patented high precision 3D-printing technologies solve packaging and interconnection challenges and offer cost benefits as well time benefits.
We support lifescience companies with customized microsystems and microfluidics for analysis (electrical and optical).
For medial applications we develop micro-mechanical parts and parallel integration of sensors. A wide range of micro-actuators, micro-needles, micro-filters with high aspect ratios and electrode fixtures are available.
The MEMS packaging method 3D-CSP offers flexibility in selecting and arrangement of elements, as well as considerable quality and cost advantages compared with TSV or wafer level packaging.
Telecommunication and automobile
We produce micro-mechatronic and multi-material MEMS and drive the miniaturization for camera modules, mechanical and optical-electronic interconnection elements and lens integration. We manufacture LED components with passive cooling for new laser generations.
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